Quality and Reliability Manager Memory Products
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 12 - 18 Years
Industry: Semiconductor / ATMP / OSAT / Memory Products
Role Overview
We are looking for a Quality and Reliability Manager to lead product-quality, package-reliability and qualification activities for memory products in a high-volume semiconductor assembly and test environment.
The role will own reliability strategy, qualification execution, product-health monitoring, failure analysis and corrective-action closure for DRAM, NAND and related memory products. The position requires strong semiconductor product-quality knowledge and experience working across packaging, assembly, test, product engineering, manufacturing and customer-quality functions.
Key Responsibilities
- Lead quality and reliability engineering for semiconductor memory products and package technologies.
- Develop product- and package-qualification strategies aligned with JEDEC and customer requirements.
- Define reliability test plans, qualification matrices, sample sizes, acceptance criteria and release requirements.
- Manage reliability testing, including HTOL, HAST/uHAST, temperature cycling, MSL and high-temperature storage.
- Review qualification results and approve products, packages, materials and process changes for manufacturing release.
- Monitor product-health, reliability, yield, defect and quality indicators during high-volume manufacturing.
- Lead investigation of reliability failures, manufacturing excursions, customer returns and field-quality issues.
- Coordinate electrical and physical failure analysis to identify package-, process-, material- and device-related causes.
- Drive root-cause analysis, containment, corrective action and recurrence-prevention activities.
- Partner with package, product, process, test and equipment engineers during NPI and production ramp-up.
- Assess reliability risks associated with material, equipment, supplier, process and package changes.
- Establish reliability-monitoring plans and early-warning mechanisms for abnormal product trends.
- Support supplier qualification and improvement programs for substrates, leadframes, mold compounds and other materials.
- Lead 8D, CAPA, FMEA and risk-assessment activities for product-quality and reliability issues.
- Prepare qualification reports, reliability summaries, risk assessments and customer-facing technical documentation.
- Support customer audits, quality reviews and technical discussions related to product and package reliability.
- Build and develop the quality and reliability engineering team.
- Ensure laboratory methods, equipment and records comply with internal and industry requirements.
Required Qualifications
- Bachelor s or Master s degree in Electronics, Electrical, Materials, Physics, Mechanical, Microelectronics Engineering or a related discipline.
- 12 18 years of semiconductor quality, product reliability, package reliability or qualification experience.
- At least 4 6 years of experience managing quality, reliability or failure-analysis engineers.
- Strong experience with semiconductor assembly, packaging and test operations.
- Knowledge of DRAM, NAND, NOR or other memory-product reliability is strongly preferred.
- Demonstrated experience planning and executing product and package qualification programs.
- Hands-on knowledge of accelerated reliability testing and failure mechanisms.
- Experience investigating qualification failures, manufacturing excursions and customer complaints.
- Strong understanding of statistical data analysis, quality systems and risk-management methodologies.
- Ability to support global teams and manufacturing escalations in a 24 7 production environment.
Technical Skills Memory Product Quality
- DRAM and NAND product quality
- Non-volatile memory reliability
- Memory-package qualification
- Product-health monitoring
- Yield and defect analysis
- Product-change qualification
- Customer-quality management
- Manufacturing-quality controls
- Field-return analysis
- Product lifecycle quality
Reliability Testing
- High-Temperature Operating Life
- Highly Accelerated Stress Test
- Unbiased HAST
- Temperature Cycling
- Thermal Shock
- Moisture Sensitivity Level
- Preconditioning
- High-Temperature Storage Life
- Low-Temperature Storage
- Board-Level Reliability
- Mechanical and environmental testing
Package Reliability
- Die-attach integrity
- Wire-bond reliability
- Intermetallic formation
- Delamination
- Package cracking
- Mold-compound and substrate interaction
- Solder-joint reliability
- Package warpage
- Electromigration and corrosion
- Thermal and mechanical stress
- Multi-die and stacked-die package reliability
Failure Analysis
- Electrical failure analysis
- Optical microscopy
- X-ray inspection
- Scanning Acoustic Microscopy
- Decapsulation
- Cross-section analysis
- SEM/EDS
- Dye-and-pry analysis
- Thermal analysis
- Fault isolation
- Failure-mechanism identification
Quality and Statistical Tools
- 8D problem-solving
- Root-cause analysis
- CAPA
- FMEA
- Fault Tree Analysis
- Design of Experiments
- Statistical Process Control
- Process Capability Analysis
- Measurement System Analysis
- Weibull and reliability-data analysis
- JMP, Minitab or equivalent software
Standards and Compliance
- JEDEC reliability standards
- ISO 9001
- IATF 16949
- AEC-Q100 awareness
- VDA 6.3
- Customer-specific quality requirements
- Change-control and qualification requirements
Leadership Responsibilities
- Build and lead a strong product-quality and reliability engineering organization.
- Assign ownership across qualification, reliability monitoring, failure analysis and customer-quality activities.
- Establish technical review, escalation and corrective-action mechanisms.
- Develop engineers through mentoring, technical training and competency planning.
- Coordinate resources during NPI, qualification, production ramp and critical quality incidents.
- Establish quality and reliability dashboards for senior-management review.
- Promote a culture of technical discipline, prevention and continuous improvement.
Key Performance Indicators
The Position Will Be Responsible For Improving
- Qualification success rate
- Product and package reliability
- Customer complaint and return rate
- Reliability failure rate
- Corrective-action closure time
- Repeat-issue prevention
- Product yield and defect performance
- NPI and manufacturing-release readiness
- Supplier-material quality
- Audit and quality-system compliance
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