ARTS, part of the TSG Group, is looking for an Electronic Packaging Design Engineer to join its R&D team.
The position is based in Yavne, Israel.
Responsibilities:
- Mechanical design and electronic packaging of complex electronic systems, from concept through production.
- Design of rugged enclosures, thermal solutions, and integration of cabling and electronic circuit boards.
- Working with subcontractors and leading tasks end-to-end.
Requirements:
- At least 2 years of experience in electronic packaging design or mechanical design of electromechanical systems.
- Experience with SolidWorks and/or AutoCAD.
- Experience designing enclosures, cabling, connectors, or integrating electronic boards.
- Experience working with manufacturing teams and subcontractors.
- Ability to work independently, with strong organizational skills and attention to detail.
- Experience in the defense industry or familiarity with military standards - an advantage.